March 2003 . Volume 2 . Issue 2
 
Welcome to Sealevel Systems' monthly newsletter. The goal is to help our valued customers easily receive timely updates on the latest Sealevel developments. We appreciate your business and continue striving to be the best communications and I/O solutions provider in the market.

In This Issue:

Ampro Computers Selects Sealevel Systems for Customer Baseboard Designs

Ampro Computers, Inc., the inventor and leading supplier of CPU modules and single board computers for non-backplane embedded systems has selected Sealevel Systems, Inc. to provide baseboard design services for system OEMs using Ampro's EnCore™ family of embedded processor modules.

“Sealevel's design capabilities ensure that Ampro’s OEM customers can quickly and cost-effectively implement EnCore-based designs even when in-house resources are not available for the baseboard design,” said Joanne Williams, president and CEO of Ampro Computers. “Complete with driver support for the leading embedded operating systems, EnCore modules and Sealevel baseboards combine to meet the I/O and software requirements of a broad base of industrial applications.”

“This synergistic partnership with Ampro will allow Sealevel to combine our core competencies of fast, reliable custom I/O design with the power and flexibility of the EnCore computing platform. The customer will be able to focus on their application software and overall system design while reaping the benefits of a custom-designed embedded computer solution,” said Tom O’Hanlan, president and CEO of Sealevel Systems.

For more details please visit http://www.sealevel.com/news.asp?news_id=14

New! eI/O Family Modular Input/Output Modules

Sealevel has announced a new embedded I/O architecture, eI/O, along with the first three eI/O board-level products. Unlike traditional I/O products, eI/O modules achieve I/O expansion in groups of 8 inputs or 8 outputs per module, allowing the user to mix and match modules as appropriate to create a customized embedded I/O architecture.

Interface to the eI/O modules is accomplished via a 50-pin ribbon cable interface compatible with a number of controllers including Sealevel’s PIO series of boards and USB adapters. The digital interface connects to the M100 baseboard that allows access to the eI/O modules via rugged 50-pin board to board interconnects. Field wiring is connected to each module via removable screw terminals.

Three eI/O modules are available now: The M200 Reed relay module provides 8 long-life dry contact switch closures; M201 optically isolated input modules monitor 12-24V DC/AC signals (resistor-selectable); and the M204 is a solid-state relay board compatible with a wide variety of SSR input/output modules. Power for the eI/O stack can be input from a remote supply or can be generated from the on-board +9 to 30V dc power regulator.

Call For More Information

Sealevel's New Website Launched March 13th, 2003!

Now finding the serial and digital I/O products you need for your application is easier than ever at www.sealevel.com! Locate PCI, ISA, Ethernet, USB, PC/104, PCMCIA and CompactPCI I/O solutions and the exact problem-solving accessories you'll need in seconds.

The new site features:

  • Online ordering including easy UPS order tracking
  • Java-enabled product selector guide – The easiest way to find the product that exactly meets your requirements
  • Easy-to-use technical support
  • Technical knowledge base
  • Printer-friendly technical specification datasheets

    Visit us online today!

Sealevel to Exhibit at 2003 Embedded Systems Conference

Sealevel will introduce our R1000 series of EnCore-based Single Board Computers and our eI/O family of modular I/O devices at the Embedded Systems Conference in San Francisco April 23rd - 25th. This is the largest Embedded Systems show and offers a number of useful training classes in addition to the show itself. Plan to attend and stop by our booth, #1543.

April 22-26, 2003- Technical Conference
April 23-25, 2003- Show Floor Open
Moscone Center, San Francisco, CA

Go to http://cmp.iconvention.com/sf/v33/index.cvn?id=10008&stab=2 for detailed conference information and registration information.

Subscribe to this eNewsletter