Yes, COM Express modules mount securely on all four corners for vibration tolerance. Many COM Express modules feature soldered processors, soldered memory and other surface mount components for increased shock and vibration resistance. High-density connectors provide a single mounting point between COM Express modules and carrier boards to eliminate multiple failure points.
The system can be designed to be completely cable-less – requiring no cables between the COM Express module, carrier board and other system interfaces. This makes a COM Express system highly suitable to rugged and high vibration applications.
Additionally, conformal and vibration coating, silicon potting and resin encapsulation can be used to maximize shock and vibration resistance.
Sealevel can help you select the appropriate COM Express module for your requirements while designing a COM Express carrier board ruggedized to the exact shock and vibration specifications for your application.