Author: Leah VanSyckel
Category: White Papers

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Beat the Heat: Thermal Engineering Solutions for Rugged Computing

By Leah VanSyckel, Charlie Phelps, and Jeff Baldwin, Sealevel Systems, Inc

For industries that require on-field computing for rugged operations in diverse, potentially harsh, environments, temperature poses a barrier. Computers must be able to withstand extreme operating temperatures. Since external thermal conditions cannot be controlled, engineers must design devices with minimal heat production. The following white paper discusses the thermal design strategies of thermal simulation, structural conception, component choice and circuit placement.

To continue reading, click on the attachment below in PDF format.