New Relio R3 COM-Express Based Industrial ComputerApril 25, 2013
Sealevel Systems, Inc. introduces the Relio R3 solid-state 3U rackmount industrial computer. The R3 brings the advantages of COM Express architecture along with easy scalability and long product lifecycle to industrial computing. The system is available with a choice of Intel i7, i3, or Atom processors and supports up to 16GB of fast DDR3 DRAM. Designed for demanding environments where reliability is a must, the R3 operates without cooling fans and offers maximum configurability for I/O intensive applications.
The R3 is loaded with standard features including dual Gigabit Ethernet, 4 USB ports with locking SeaLATCH connectors, 2 RS-232 and 1 RS-485 serial ports, video, and audio interfaces. The system runs from an internal 2.5″ solid-state SATA hard drive and is compatible with Windows and Linux operating systems.
For a flexible I/O interface, up to 18 expansion modules can be added for analog, digital, and serial functionality that match specific application requirements. A PCIe expansion slot is also included. The system includes a 7″ color touchscreen LCD on the front panel for intuitive operator interface.
The R3 runs from external 18-36 VDC power and is rated for a wide 0°C to 50°C operating temperature range. Extended temperature range and other options are available.
Sealevel’s COM Express systems use a Computer on Module (COM) architecture that supplies the core computing functionality and high-speed communication interfaces. The COM module combines with a system-specific carrier board supplying power and interface connectors. This modular approach provides an easy upgrade path for the core processing functions that are most likely to change, making technology refresh easy and extending the useful lifecycle of the system.
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