Custom Manufacturing

Custom Manufacturing

All product design and assembly takes place at our ISO 9001:2015 registered manufacturing facility, located in the United States of America. These processes are subject to our rigorous quality standards to meet our high-reliability guarantee for critical communications electronics.

Our state-of-the art Surface Mount Technology (SMT) line consists of an Automated Screen Printer with 2D Inspection, three High Speed SMT pick and place machines, a Ten Zone Forced Convection Reflow Oven and a 5-Camera Automated Optical Inspection system.

Following initial build, our in-house team of J-STD-001 and IPC-A-610 certified technicians completes through hole soldering.

For final assembly, Sealevel technicians follow detailed procedures for building, labeling and any required modifications.

Our facility features a dedicated “Special Projects” area that allows for enhanced physical security and is fully configurable to optimize production for OEMs.

Areas of Expertise

  • High Speed Surface Mount Technology (SMT)
  • Printed Circuit Board (PCB) Assembly
  • Through Hole Assembly
  • Board Level Assembly
  • Box Build Assembly
  • Automated Screen Printing with 2D Inspection
  • Automated Optical Inspection
  • Closed-Loop Inline Aqueous Cleaning
  • Automated Conformal Coating
  • Multi-Angle Transmissive X-Ray
  • Vibration & Thermal Screening