Members of our leadership team were recently interviewed about obstacles – and strategies – for NPI (new product introduction). Not surprisingly, the global supply chain…
Adopting CIP to Industrial Networks
Sealevel’s SMT Process & Future Growth
Sealevel’s printed circuit board assembly process is driven by a state-of-the-art Surface Mount Technology (SMT) line. SMT manufacturing is the use of automated machines to…
Supporting Military Test & Measurement Applications
Mission critical communications: perhaps nowhere is this term more applicable than in the military and aerospace industry. Across land, sea, air and space, equipment must…
5-Wire Resistive Touchscreens for Rugged Panel PCs
Enclosure design, component selection and placement are vital industrial engineering techniques. However, in the case of rugged touch panel PCs, the touchscreen itself moves quickly…
Meeting SWaP & Rugged Computing Requirements
Military and aerospace applications have long demanded SWaP optimization. Now, the increased use of AI and robotics have engineers and manufacturers doubling down on the…
Wind Floats: The Offshore Wind Industry Comes to America
Over 30 years since the first offshore wind farm was installed in Denmark, the United States is ready to embrace offshore wind farms. Bolstered by…
The Top Trends Influencing I/O Systems Design
Members of Sealevel’s sales team share their observations and predictions as to the top trends – and challenges – that are influencing and changing I/O…
Improving Compliance Testing & Product Development with Oscilloscopes
Sealevel’s in-house engineering team recently upgraded their primary oscilloscope to a LabMaster 10 Zi-A High Bandwidth Modular Oscilloscope. This series of oscilloscopes from Teledyne LeCroy…