Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023

February 21, 2023

Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at Embedded World 2023. Sealevel’s international team will showcase the smallest available, full-feature Compact Type 6 carrier board, the dominant touch panel PC and a wide range of ruggedized, reliable I/O systems.

Embedded World will take place March 14-16, 2023 in Nuremberg, Germany. Conversations and presentations will explore the multifaceted world of embedded systems – from hardware and software to services and tools.

Featured Sealevel products at Embedded World 2023 include the following solutions:

  • 12009 COM Express Compact Type 6 Carrier Board
    Released in October 2022, the 12009 Compact Type 6 Carrier Board will make its international debut at Embedded World. At 95 millimeters square, the 12009 is identical in size to a Compact Type 6 COM Express module, making it the smallest-in-industry Type 6 carrier board. Designed to meet a wide variety of application needs, the 12009 evaluation board supplies a diverse I/O mix and robust processing support.
  •  HazPAC 10® Rugged Panel PCHazPAC 10 - 8.4" Touchscreen
    The HazPAC 10® Rugged Panel PC has quickly emerged as the preferred touchscreen solution for hazardous locations in both commercial and defense applications. The HazPAC 10 features a fanless industrial computer with a wide -40°C to 60°C operating temperature. And for the most intense environments, the HazPAC 10 has a NEMA 4/IP64 front bezel and is certified by ATEX, IECEx, and for Class I, Division 2 (Groups A, B, C, D, T4). Available with an 8.4” or 15” five-wire resistive touchscreen, the HazPAC 10 is perfect for a wide variety of control and HMI applications.
  • Embedded SuperSpeed USB 3.1 Hubs
    Sealevel’s Embedded SuperSpeed USB 3.1 Hubs for OEM applications achieve SuperSpeed operation and meet the requirements to supply 1500mA per port simultaneously. The hubs feature expansive ESD protections and an industry-leading -40°C to 85°C operating temperature, as well as backward compatibility with legacy peripherals. USB hubs that maintain reliable operation when subjected to environmental extremes have been difficult to source – these 4-port and 7-port USB 3.1 hubs from Sealevel are the most viable option available. 

Embedded World attendees are invited to visit the Sealevel team at Hall 3, Booth 359 for hands-on demonstrations.

Embedded World Participation Part of International Expansion

As announced in January 2023, Sealevel is currently expanding its international technical sales network and actively recruiting distributor partners to grow its team. Sealevel is hosting meetings adjacent to the Embedded World agenda, with an invitation-only “Commerce & Cocktails” event on Monday, March 13 prior to the exhibition’s commencement. To schedule a private meeting, please contact Marc Foster by emailing