Beat the Heat: Thermal Engineering Solutions for Rugged Computing
By Leah VanSyckel, Charlie Phelps, and Jeff Baldwin, Sealevel Systems, Inc
For industries that require on-field computing for rugged operations in diverse, potentially harsh, environments, temperature poses a barrier. Computers must be able to withstand extreme operating temperatures. Since external thermal conditions cannot be controlled, engineers must design devices with minimal heat production. The following white paper discusses the thermal design strategies of thermal simulation, structural conception, component choice and circuit placement.
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