New product introduction (NPI) presents a wide set of challenges for engineers and manufacturers. More specifically, NPIs for embedded computing and critical communications products introduce…
COM Express: Finding the Right Type
COM Express is a family of modular, small-form-factor computer-on-module (COM) specifications defined by the PCI Industrial Computer Manufacturers Group (PICMG). A nonprofit consortium of companies…
Firmware: Capitalizing on IP & Enabling Hardware
Firmware is low-level software that is embedded directly into a hardware device. The actual code – depending on the device this is usually some combination…
SWaP-C & SWaP-C2: What’s Next for Embedded Computing
As aerospace and defense technologies are becoming more and more complex – in terms of capabilities and feature/component density – the successful deployment of new…
Mitigating Supply Chain Challenges with Made in the USA
Members of our leadership team were recently interviewed about obstacles – and strategies – for NPI (new product introduction). Not surprisingly, the global supply chain…
COM-HPC: The New Standard in Modular Computing
COM-HPC stands for Computer-on-Module for High Performance Computing and is the next-generation standard for modular computing systems. As technology continues to advance, demands grow for…
Enclosure & Environmental Ratings: An Overview
Rugged tech must perform under challenging conditions. Because specific hazards vary in location and situation, standards exist to classify equipment performance. IP and NEMA ratings…
Why Use COM Express?: The Rise of Configurable Computing Part II
COM Express as a SOC is a complete computer and thus can be used on its own. It is a “plug and play” device without…
Meet Wallace and Learn to Love 3D Printing
“That’s amazing!” (or some variation) are usually the first words people say when I show them a 3D printed object. That I created. On my…