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Torvex

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Torvex

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Torvex - NVIDIA Jetson Orin AGX AI Computer Datasheet
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Product Details

Sealevel System’s Torvex is a powerful, rugged AI system built around the NVIDIA Jetson AGX Orin Industrial module. With a compact 200mm x 250mm x 100mm footprint and a weight of approximately 7kg, this system is engineered for maximum reliability in extreme environments, supporting a wide 12-36VDC input range.

The Torvex features high-performance I/O and expansion capabilities, including PCIe Gen 4 and Gen 3 M.2 slots for storage and SDI capture, multiple Ethernet ports (up to 10Gbe), and advanced wireless options with support for Wi-Fi 6E. This system offers extensive connectivity such as USB 3.1 Gen 1, isolated serial console, software selectable RS232/422/485 ports, CAN bus, optically isolated inputs, and dry contact digital inputs, all housed in a rugged, IP67-rated enclosure with IP68-rated military connectors for uncompromised durability. It provides DisplayPort 1.4 video output, a galvanically isolated power supply, and accessible cable mounted controls for power, reset, and recovery.

The Torvex system is designed for mission-critical deployments with compliance to MIL-STD-461G, MIL-STD-810G, DO-160G, MIL-STD-1275E, ISO IEC 60529:2013, FCC Class A, and CE standards, and supports Red Hat and Ubuntu 22.04 operating systems with a path to Ubuntu 24.04 and Jetpack 7, ensuring both performance and regulatory peace of mind for the most demanding applications.

  • Specifications
  • Software & Documentation

Specifications

  • Family

    Torvex

  • CPU Type

    Arm® Cortex®

  • Memory

    64GB 256-bit LPDDR5 204.8GB/s

  • CPU

    12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3

  • Display Support

    (1) DisplayPort

  • Serial Ports

    (1) Isolated Serial Console - USB Type B pinout, (2) RS232/RS422/RS485 Ports (software selectable)

  • Networking

    (2) 2.5GbE Ports, (1) 1GbE Port, (1) 10GbE Port, (1) M.2 E Key for wireless capability

  • USB 3.0 Ports

    (3) USB 3.1 Gen 1 Ports

  • Power Requirement

    12-36VDC (TBD)

  • Operating Temperature

    -40°C to +60°C (-40°F to 140°F) (TBD)

  • Storage Temperature

    -40°C to 85°C (-40°F to 185°F)

  • Humidity Range

    10 – 90% Relative Humidity, Non-Condensing

  • Dimensions

    7.87” (L) X 10.26” (W) X 3.93" (H)

  • Additional I/O

    (4) Optically Isolated Inputs (4) Solid State Relay Inputs

  • CAN Bus

    (2) CAN Bus Ports

  • Ingress Protection (IP)

    IP67-Rated Enclosure and IP68-rated military round connectors

  • Expansion Slots

    (1) PCIe Gen 4 and (1) PCIe Gen 3 M.2 slots for storage and SDI capture

  • Certifications

    MIL-STD-461G, DO-160G, MIL-STD-810G, ISO IEC 60529:2013, MIL-STD-1275E, FCC Class A, CE

  • TOPS

    248 TOPS

  • GPU

    2048-core NVIDIA Ampere GPU with 64 Tensor Cores

Software & Documentation

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