Sealevel at ewNA 2026: Embedded Compute, I/O, and Edge AI

Sealevel at ewNA 2026 | Anaheim, CA - Anaheim Convention Center | Booth #5500 | September 22-24, 2026

Hardware for Connected, Intelligent Embedded Systems

As embedded systems become more connected, intelligent, and data-driven, the hardware behind them has to keep pace. From machine control and robotic systems to industrial networking and edge AI, reliable computing and  I/O are critical to turning automation strategy into real-world performance.

At ewNA 2026, Sealevel is showcasing industrial hardware solutions that help engineers connect, control, and scale automation systems with confidence. Explore flexible I/O, EtherNet/IP-ready connectivity, rugged embedded computing, and high-performance edge platforms designed to support modern automation architectures.

System Integration

Reduce System
Integration Time

Use proven COTS hardware foundations to accelerate system development and reduce redesign complexity.

Modular Architectures

Support Modular
Architectures

Combine compute, I/O, expansion, and communication interfaces to support evolving system requirements.

Bridge Legacy and Modern Systems

Bridge Legacy and
Modern Systems

Connect existing equipment with newer embedded platforms through reliable I/O and communication interfaces.

Scale from Standard to Custom

Scale from Standard
to Custom

Adapt standard platforms through Sealevel’s in-house engineering, manufacturing, and lifecycle support.

FEATURED AT ewNA 2026

From Machine I/O to Edge Intelligence

Explore Sealevel hardware on display across the connected manufacturing architecture—from machine data and industrial I/O to rugged edge computing, workload consolidation, AI acceleration, and machine vision.

SeaI/O industrial I/O module

SeaI/O

Flexible distributed I/O for machine control, monitoring, and data acquisition.

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Serial I/O solutions

Serial I/O

Serial I/O Sealevel asynchronous andsynchronous serial I/O interfaces are designed for high-speed applications.

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Relio R1 rugged embedded computer

Relio R1 Family

Rugged industrial edge computing for control, monitoring, communications, and local processing near the machine.

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Relio R1 HPC+ high-performance edge computer

Relio R1 HPC+

High-performance edge computing for workload consolidation, AI acceleration, high-speed networking, and hypervisor-enabled architectures.

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Torqx NVIDIA-based edge AI computing platform

Torvex

Rugged NVIDIA Jetson AGX Orin-based computing for machine vision, AI inference, and sensor-rich edge applications.

Explore

Featured Technical Sessions

Learn With Sealevel at embedded world North America

Go beyond the booth with practical engineering sessions focused on two critical embedded-system decisions: selecting the right compute architecture for the workload and designing hardware that can evolve across long deployment lifecycles.

Jeff Baldwin, Director of Engineering at Sealevel Systems
Jeff Baldwin Director of Engineering

Embedded AI

Right-Sizing Compute at the Edge

How to Match CPUs, GPUs, and AI Accelerators to Your Application

Tuesday, September 22 11:00 AM Room 202

Selecting more compute isn't the same as selecting the right compute. Explore how workload characteristics, latency, power, thermal constraints, I/O, and deployment requirements influence CPU, GPU, and AI accelerator decisions.

Key takeaways

  • Determine the workload of the application before selecting the processor.
  • Understand where CPUs, GPUs, integrated AI engines, and dedicated accelerators fit.
  • Balance performance against power, thermal, I/O, lifecycle, and deployment constraints.
View Conference Program
Jeff Kleck, Senior Computer Hardware Design Engineer at Sealevel Systems
Jeff Kleck Senior Computer Hardware Design Engineer

Embedded AI

Designing Modular, AI-Ready Hardware for 10+ Year Embedded Deployments

Tuesday, September 22 1:30 PM Room 202

Embedded platforms may remain deployed for a decade or more while processors, accelerators, interfaces, and application requirements continue to change. Learn architecture strategies that allow systems to evolve without forcing a complete redesign.

Key takeaways

  • Separate long-life system requirements from rapidly changing compute technology.
  • Evaluate modular compute, expansion, and acceleration strategies.
  • Design for future performance, I/O, lifecycle, and AI requirements.
View Conference Program
Integrated Capability

Engineered, Manufactured, and Supported Under One Roof

For long-lived manufacturing applications, reliability extends beyond the hardware itself. Sealevel’s vertically integrated approach brings engineering, manufacturing, testing, and technical support together under one roof, helping customers maintain greater control over product quality, configuration, lifecycle, and change as systems move from development into production.

Sealevel delivers long-term program continuity through:

  • In-house engineering, manufacturing, testing, and technical support
  • Quality systems, traceability, and controlled product change
  • Rugged embedded computing, I/O, and communication expertise
  • Standard platforms that can scale with evolving requirements
  • Custom and COTS solutions backed by 40 years of engineering experience
Sealevel AS9100 certified manufacturing facility

Meet the Sealevel Team at Booth #5500

Visit Sealevel at booth #5500 to explore the hardware layer behind connected manufacturing—from industrial I/O and EtherNet/IP connectivity to rugged edge computing, workload consolidation, AI acceleration, and machine vision.

Bring us your system architecture, interface requirements, environmental constraints, or lifecycle challenges. Our team can help evaluate the right standard or custom path for machine connectivity, edge compute, consolidation, and advanced AI or vision applications.

Earle Foster

Earle Foster

Sr. VP Sales

Earle has more than 35 years of sales, management and leadership experience. He helps guide customers toward the best I/O and computing solutions, from off-the-shelf products to custom, application-specific designs.

Marc Foster

Marc Foster

Western Regional Sales Manager

Marc joined the Sealevel team in 2001. A proud Clemson Tiger, Marc specializes in solutions for defense and industrial automation applications, working with customers to address their specific needs.

Joe Albertson

Joe Albertson

Senior Sales Engineer

A self-proclaimed COM Express aficionado, Joe will happily share his passion and give guidance on all things embedded. The only other competitor for his interest: sync serial.

Steve Mueller

Steve Mueller

Central Region Sales Manager

Steve is a seasoned professional with over a decade of experience supporting strategic solutions for Medical, Transportation and Industrial OEMs.

Jeff Baldwin

Jeff Baldwin

Director of Engineering

Baldwin is versed in best practices for all aspects of complex computing designs: incorporating manufacturability, SWaP-C2 optimization, and a variety of compliance requirements related to EMI/EMC, safety and security.

Van Miller

Van Miller

Product Marketing Manager

Van Miller is a product marketing and creative professional skilled in brand strategy, visual design, product photography, and campaign execution.

Sealevel — Forty & Forward

For 40 years, Sealevel Systems has engineered rugged computing and I/O solutions trusted across defense, aerospace, and industrial sectors. From our roots in solving complex integration challenges to our current role as a supplier of resilient, high-performance hardware, we honor the progress, partnerships, and people who shape our journey. As we look Forty & Forward, we remain focused on enabling dependable performance where it matters most.